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Willi Volksen
Willi Volksen
Research Staff Member, IBM Almaden Research Center
Verified email at us.ibm.com
Title
Cited by
Year
Selectively functionalized porous material
GJ Dubois, B Michel, P Ruch, S Saliba, W Volksen
US Patent 11,498,063, 2022
2022
Implementing the post-porosity plasma protection (P4) process using I-CVD
K Lionti, GJM Dubois, W Volksen, J Faguet
US Patent 11,371,143, 2022
2022
Surface modification by polymer anchoring on porous substrates
GJM Dubois, K Lionti, TP Magbitang, W Volksen
US Patent 11,174,412, 2021
2021
Enhanced adhesive materials and processes for 3D applications
JL Hedrick, RD Miller, DA Neumayer, S Purushothaman, ME Rothwell, ...
US Patent 11,168,234, 2021
2021
Nitrogen heterocycle-containing monolayers on metal oxides for binding biopolymers
SJ Han, B Lin, HT Maune, CT Rettner, LK Sundberg, LE Thompson, ...
US Patent 10,915,023, 2021
12021
Enhanced adhesive materials and processes for 3D applications
JL Hedrick, RD Miller, DA Neumayer, S Purushothaman, ME Rothwell, ...
US Patent 10,767,084, 2020
12020
Enhanced adhesive materials and processes for 3d applications
JL Hedrick, RD Miller, DA Neumayer, S Purushothaman, ME Rothwell, ...
US Patent App. 16/002,353, 2019
82019
Selectively functionalized porous material
GJ Dubois, B Michel, P Ruch, S Saliba, W Volksen
US Patent 10,471,418, 2019
12019
Surface modification by polymer anchoring on porous substrates
GJM Dubois, K Lionti, TP Magbitang, W Volksen
US Patent 10,370,556, 2019
2019
Surface chemical functionalization to achieve extreme levels of molecular confinement in hybrid nanocomposites
C Wang, SG Isaacson, Y Wang, K Lionti, W Volksen, TP Magbitang, ...
Advanced Functional Materials 29 (33), 1903132, 2019
182019
Enhanced via fill material and processing for dual damscene integration
JP Doyle, G Dubois, NC Fuller, TP Magbitang, RD Miller, ...
US Patent 10,340,182, 2019
2019
Articles including ultra low dielectric layers
RL Bruce, GJ Dubois, G Fritz, TP Magbitang, H Miyazoe, W Volksen
US Patent 10,217,661, 2019
2019
Using Unentangled Oligomers To Toughen Materials
SG Isaacson, Y Matsuda, K Lionti, T Frot, W Volksen, RH Dauskardt, ...
ACS applied materials & interfaces 10 (33), 27549-27554, 2018
102018
Enhanced adhesive materials and processes for 3D applications
JL Hedrick, RD Miller, DA Neumayer, S Purushothaman, ME Rothwell, ...
US Patent 9,994,741, 2018
82018
Enhanced via fill material and processing for dual damascene integration
JP Doyle, G Dubois, NC Fuller, TP Magbitang, RD Miller, ...
US Patent App. 15/863,675, 2018
2018
Synthesis of polyimides in molecular-scale confinement for low-density hybrid nanocomposites
SG Isaacson, JI Fostvedt, H Koerner, JW Baur, K Lionti, W Volksen, ...
Nano letters 17 (11), 7040-7044, 2017
142017
Accurate measurement of porous low-k thin-films by nanoindentation: densification scaling versus substrate effects
K Lionti, K Virwani, W Volksen, R King, J Frommer, G Dubois
ECS Journal of Solid State Science and Technology 6 (10), N209, 2017
72017
Method of manufacturing an ultra low dielectric layer
RL Bruce, GJ Dubois, G Fritz, TP Magbitang, H Miyazoe, W Volksen
US Patent 9,773,698, 2017
2017
Determination of young'S modulus of porous thin films using ultra-low load nano-indentation
GJ Dubois, JE Frommer, RS King, K Lionti, KR Virwani, W Volksen
US Patent 9,766,170, 2017
22017
Toughening hybrid nanocomposites with molecularly confined polymers by chemically tuning the polymer-surface interaction
C Wang, S Isaacson, K Lionti, W Volksen, T Magbitang, R Dauskardt, ...
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY 253, 2017
2017
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