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As the size scale of device features becomes ever smaller, conventional lithographic processes become increasingly more difficult and expensive, especially at a minimum feature size of less than 45 nm. Consequently, to achieve higher-density circuits, storage devices, or displays, it is evident that alternative routes need to be developed to circumvent both cost and manufacturing issues.An ideal process would be compatible with existing technological processes and manufacturing techniques; these strategies, together with novel materials, could allow significant advances to be made in meeting both short-term and long-term demands for higher-density, faster devices. The self-assembly of block copolymers (BCPs), two polymer chains covalently linked together at one end, provides a robust solution to these challenges. As thin films, immiscible BCPs self-assemble into a range of highly ordered morphologies …